Fabricant | No de pièce | Fiches technique | Description |
TOKYO SEIMITSU CO., LTD |
GC
|
385Kb / 2P |
RESIN BOND BLADES FOR GLASS & CERAMICS
|
HM
|
420Kb / 2P |
METAL BOND BLADES
|
GM
|
408Kb / 2P |
METAL BOND BLADES FOR GLASS
|
Infineon Technologies A... |
TT190N16SOF
|
912Kb / 11P |
Solder-Bond Technology
2017-06-14 Revision: 3.2 |
TT320N16SOF
|
988Kb / 11P |
Solder-Bond Technology
2017-06-14 Revision: 3.7 |
DD340N20S
|
578Kb / 10P |
Solder-Bond Technology
2017-06-21 Revision 3.7 |
DD180N18S
|
435Kb / 10P |
Solder-Bond Technology
2017-08-24 Revision 3.3 |
TT160N18SOF
|
744Kb / 11P |
Solder-Bond Technology
2017-06-14 Revision: 3.1 |
TT190N18SOF
|
912Kb / 11P |
Solder-Bond Technology
2017-06-14 Revision: 3.1 |
DD180N16S
|
358Kb / 10P |
Solder-Bond Technology
2017-08-24 Revision 3.3 |